We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Fin Heat Sink.
ipros is IPROS GMS IPROS One of the largest technical database sites in Japan that collects information on.

Fin Heat Sink(IGBT) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Fin Heat Sink Product List

1~5 item / All 5 items

Displayed results

Large heat sink 400mm wide SK159 forced air cooling

High-density pressed fin structure for powerful cooling of high heat generation. Large heat sink with a width of 400mm.

The high-performance heat sink "SK159" is designed to accommodate a large size of 400mm in width. Its press-fit fin structure enables a high-density fin arrangement, demonstrating excellent heat dissipation performance during forced air cooling. It is ideal for cooling applications of high-heat-generating devices such as IGBTs and inverters. By combining the fins and base in a separate structure, it allows for a high-density design that is difficult to achieve with extruded heat sinks, providing efficient heat diffusion and stable cooling performance. It is widely adopted for thermal management in large equipment and high-output devices. Additionally, as an authorized dealer, we can provide consistent support from specification review and prototype evaluation to mass production startup. If you provide us with drawings and conditions, we will offer optimal product selection and technical proposals.

  • sk158_162.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors
  • Fin Heat Sink

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

φ28.5×H12.5 Round Pin Fin Heat Sink Al99.5

High thermal dissipation round pin fin heat sink ideal for forced air cooling of small machinery.

This is a round pin fin heat sink designed with a compact and thin profile of φ28.5×H12.5mm. Its high-density pin fin structure efficiently disrupts airflow, demonstrating excellent heat dissipation performance during forced air cooling. By using aluminum alloy (Al99.5), it achieves both lightweight and high thermal conductivity, making it suitable for thermal management in limited spaces. When combined with small fans or blowers, it enables efficient cooling of heat-generating components such as power semiconductors, LEDs, and power modules.

  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • 1740782861.jpg
  • Other semiconductors
  • Fin Heat Sink

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

φ50×H30 round pin fin heat sink Al99.5

Φ50 round pin fin heat sink that exhibits high heat dissipation through forced air cooling.

This is a round pin fin heat sink that adopts a standard size of φ50×H30mm. Its high-density pin fin structure efficiently disrupts the airflow, demonstrating excellent heat dissipation performance in forced air cooling environments. By using aluminum alloy (Al99.5), it achieves both lightweight and excellent thermal conductivity, enabling efficient thermal design when combined with fans or blowers. It is suitable for cooling applications of electronic devices with high heat density, such as power semiconductors, LEDs, and power modules.

  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • 1782975259.jpg
  • Other semiconductors
  • Fin Heat Sink

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

φ40×H10 Round Pin Fin Heat Sink Al99.5

Thin design high thermal conductivity round pin fin heat sink compatible with forced air cooling.

This is a round pin fin heat sink with a thin and compact design of φ40×H10mm. Its high-density pin fin structure efficiently disrupts the airflow, demonstrating excellent heat dissipation performance in forced air cooling environments. By using aluminum alloy (Al99.5), it achieves both lightweight and high thermal conductivity, making it suitable for thermal management in limited spaces. When combined with small fans or blowers, it enables efficient cooling of heat-generating components such as power semiconductors, LEDs, and power modules.

  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • 4010D.jpg
  • Other semiconductors
  • Fin Heat Sink

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

φ98×H50 round pin fin heat sink Al99.5

Round pin fin heat sink with large size and high heat dissipation performance.

This is a round pin fin heat sink that adopts a large size of φ98×H50mm. Its high-density pin fin structure efficiently disrupts the airflow, demonstrating excellent heat dissipation performance in forced air cooling environments. By using aluminum alloy (Al99.5), it achieves both lightweight and high thermal conductivity, effectively addressing the thermal management of high-heat-generating devices. When combined with fans or blowers, it can be used in a wide range of applications, including power semiconductors, power modules, and industrial electronic equipment.

  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • 1737000620.jpg
  • Other semiconductors
  • Fin Heat Sink

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration